Polysulfone resin, molecular formula: (C 27 H 22 O 4 S) n , is a white granular solid, sealed in a cool and dry environment, used to produce polyester cotton, non-woven fabrics, etc., Used as heat-resistant, corrosion-resistant, high-strength parts and insulating parts, industrial films, etc. in electrical appliances, electronics, instruments, meters and aerospace departments, used as a toughening agent for epoxy resin, and formulated high-strength, high-temperature structural adhesives.
Flow performance |
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Test items |
Test Standard |
Test Conditions |
Unit |
Typical value |
Melt flow rate |
GB/T 3682-2000 |
343℃ 5KG |
g/10min |
9/20 |
Mechanical performance |
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Test items |
Test Standard |
Test Conditions |
Unit |
Typical value |
Bending strength |
GB/T 9341-2008 |
Room temperature 23℃ |
MPa |
99 |
Flexural modulus |
GB/T 9341-2008 |
Room temperature 23℃ |
GPa |
2.5 |
Tensile Strength |
GB/T 1040.2-2006 |
Yield 23℃ |
MPa |
75 |
CHARPY Impact Strength |
GB/T 1043.1-2008 |
There is a gap |
kJ/m² |
7.0/6.5 |
Thermal performance |
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Test items |
Test Standard |
Test Conditions |
Unit |
Typical value |
Glass transition temperature |
GB/T 19466.2-2004 |
10℃/min |
°C |
190 |
Heat distortion temperature |
GB/T 1634.1-2004 |
1.8MPa 120℃/h |
°C |
171 |
Thermal expansion coefficient |
GB/T 36800.2-2018 |
10℃/min |
ppm/k |
55 |
Electrical Thermal performance |
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Test items |
Test Standard |
Test Conditions |
Unit |
Typical value |
Volume resistivity |
GB/T 1410-2006 |
23℃ |
(Ω∙cm) |
3.1×10¹⁶ |
Surface resistivity |
GB/T 1410-2006 |
23℃ |
Ω |
1.2×10¹⁶ |
Dielectric strength |
IEC 60243-1 |
23℃ |
KV/mm |
17 |
Other |
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Test items |
Test Standard |
Test Conditions |
Unit |
Typical value |
Density |
GB/T 1033-2008 |
23℃ |
g/cm³ |
1.24 |
Water absorption |
GB/T 1034-2008 |
24h 23℃ |
% |
0.3 |
Hardness Shore D |
GB/T 2411/2008 |
23℃ |
– |
62 |
Polysulfone (PSU)
1. Electrical appliances, electronics
Taking advantage of PSU’s solder resistance, good dimensional stability, resistance to various cleaning agents, inlay metal parts, and good adhesion with epoxy resin, it is used as a Class H insulating material in the electronics and electrical fields.
2. Medical appliances, food processing machinery
It can be sterilized by steam sterilization, dry steam (180) sterilization, V-ray sterilization and other sterilization methods, and can be resistant to repeated sterilization. The main products developed include contact lens sterilizers, dental drill handles, etc., valves for the food industry, etc.
3. Hot water field
It is mainly used to maintain excellent creep resistance, rigidity and dimensional stability in 160 hot water or steam. The main products developed include valves for hot water and steam, insulators for anti-corrosion electrodes, components for temperature sensors, pump bodies and impellers for various liquid and powder pumps, radiator valves, parts for ultrafiltration devices, etc.
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